Sponge pad with adapter, Vertical vacuum inlet direction, Pad material: conductive silicone, conductive CR, Pad O.D.: 4, 6, 8, 10, 15, Oval Pad with Buffer, VACUUM PAD, ZP, ZP2, ZP3, 26.07 lb

Accepts nylon and urethane tubes, Applicable for both vacuum and positive pressure applications, Release collar allows easy removal of tubing without damaging the tube, Maximum vacuum pressure of 1.0MPa, FITTING, UNION Y, CONNECTORS, KQ2 FITTING, CR, KQ2 4MM, .01269 lb

Sponge pad with adapter, Vertical vacuum inlet direction, Pad material: conductive silicone, conductive CR, Pad O.D.: 4, 6, 8, 10, 15 VACUUM PAD, ZP, ZP2, ZP3. OVAL CUP WITH BUFFER. 28.28000 lb. M30.

Finger Stroke: Standard, Bore Size: 16mm, Action: C [Single Acting (Normally Closed)], Finger Material: Carbon Steel, Dust Cover: Chloroprene Rubber (CR), Auto Switch: M9BV--Solid State, Gen. Purpose, 2 Wire, Vertical, 0.5M, Lead Wire or Prewired Connector: L (3m)

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. Light weight and compact; Uniform baking temperature; High fluorine resistance; Low outgassing; Little heavy metal contamination

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. High vacuum angle valve; Type: manual, bellows seal; Flange size: 16 ~ 50; Heater type: H1 (80°C), H2 (100°C), H3 (120°C); Auto switches not available

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. Light weight and compact; Uniform baking temperature; High fluorine resistance; Low outgassing; Little heavy metal contamination

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. Compatible with inert gases; Flange sizes: 25 and 40; Operating pressure range: Atmospheric to 0.01 Pa; Operating temperature: 5-40°C; Voltage options: (100, 110, 200, 220, 230, 240)VAC; (12, 24)VDC

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. Light weight and compact; Uniform baking temperature; High fluorine resistance; Low outgassing; Little heavy metal contamination

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. Light weight and compact; Uniform baking temperature; High fluorine resistance; Low outgassing; Little heavy metal contamination

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. High vacuum angle valve; Type: manual, bellows seal; Flange size: 16 ~ 50; Heater type: H1 (80°C), H2 (100°C), H3 (120°C); Auto switches not available

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. XLF is a normally closed, single acting high vacuum angle valve with an O-ring shaft seal.  The XL*-2 family shares common features with all series members. 

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers.