The KF series can used for a wide range of pressures from vacuum up to a pressure of 1.0MPa.Suitablefor use with nylon, soft nylon and urethane tubing, Large retaining force, Low tightening torque, Wide range of pressures from vacuum up to 1.0MPa, UNION NUT, Ni PLATED, INSERT FITTING, 905, 3.00000 lb

Please contact us for the latest version.sales@ocaire.com, VALVE DBL PLUG-IN BASE MT, VALVE, VFS2000 SOL VALVE 4/5 PORT, NI, VFS2000 BASE MT 1/8, 1.21254 lb

Please contact us for the latest version.sales@ocaire.com, VALVE, DBL SOL, BASE MT (DC), VALVE, SY3000 SOL/VALVE, RUBBER SEAL, NI, SY BASE MT 1/8, .24802 lb

Please contact us for the latest version.sales@ocaire.com, VALVE, DBL SOL, BASE MT (DC), VALVE, SY3000 SOL/VALVE, RUBBER SEAL, NI, SY BASE MT 1/8, .13992 lb

Please contact us for the latest version.sales@ocaire.com, VALVE, DBL SOL, BASE MT (DC), VALVE, SY3000 SOL/VALVE, RUBBER SEAL, NI, SY BASE MT 1/8, .13992 lb

Please contact us for the latest version.sales@ocaire.com, VALVE, DBL SOL, BASE MT (DC), VALVE, SY3000 SOL/VALVE, RUBBER SEAL, NI, SY BASE MT 1/8, .17321 lb

Please contact us for the latest version.sales@ocaire.com, VALVE, DBL SOL, BASE MT (DC), VALVE, SY3000 SOL/VALVE, RUBBER SEAL, NI, SY BASE MT 1/8, .12747 lb

Please contact us for the latest version.sales@ocaire.com, VALVE, DBL SOL, BASE MT (DC), VALVE, SY3000 SOL/VALVE, RUBBER SEAL, NI, SY BASE MT 1/8, .14300 lb

Please contact us for the latest version.sales@ocaire.com, VALVE, BASE MOUNT (DC), VALVE, VQZ1000 VALVE, SOL 4/5-PORT, NI, VQZ1000 BASE MNT 1/8, .21465 lb

AMX-OM-F005-C

Chem i cal s Corrosi ve gas + Atm osphere contai ni ng organi c sol vent Envi ronm ent l ow er than Envi ronm ent 5 H i gher t han 60 Vi brati on, i m pact Precaut i ons f or i nst al l at i on. I nstal l verti cal l y. Ensure no l eakage. Fl ush i nsi de of pi pi ngs w i th ai r. D o not pi pe upw ardl y. Keep si ght gl ass i n f ront . D rai n w hi l e l i qui d l evel i s vi si bl e.

AMX-OM-L020_e

W ARN I N G M AI N LI N E FI LTER Seri es AFF Chem i cal s Corrosi ve gas + At m osphere Cont ai ni ng organi c sol vent *N . C. aut o drai n: M i n. 0. 15 M Pa *N . O . auto drai n: M i n. 0. 1 M Pa O PERATI O N M AN U AL M i n. 0. 05 M Pa Keep f ol l ow i ng t o operat e M ai n l i ne f i l t er properl y. M ax. 1. 0 M Pa Fol l ow i ng envi ronm ent s l ead t o cause breakage.

Round Type Hydraulic Cylinder

8 18.5 87 20 160 178.5 40 34 f8 Up to 800 21 M33 x 2 M16 x 1.5 24 24 12 24 18 21 14 11 54 10 48 7.5 19 44 24 21 1/4 22.5 108 20 182 204.5 322 Round Type Hydraulic Cylinder: 3.5 MPa CHM Series Accessories (Standard) Rod end nut Mounting nut 30 30 d d CHQ C D D C CHK H B B H Material: Carbon steel Material: Carbon steel CHN Part no. d H B C D Applicable bore size (mm) NT-02 NT-03 NT-04 AC-NI

Cylinder

SWitch sulfix Nil Standard Ni/--With two switches D--With auto switch I I S -With one switch Cbuilt in magnet) 'S; 5 stroke: S type only I 1 I Switch type Type of mounting .o-__.---J Nil --Without auto switch 9O---D-90(O.5m lead wire) B Nose mount I I I T.

Model: 00 [3000 psig (20.7 MPa); 2400 psig (16.5 MPa) for size 3/4 Inch; Cv 0.7, Multi Turn Round Knob], Material: H (Ni-Cr-Mo Alloy), Surface Finish: M [10 μin. (0.25 μm)], Connection 1: MV8 (1/2 Inch Face Seal, Male), Connection 2: TW8 (1/2 Inch Tube Weld), Seat Material: PCTFE, Standard

.· Surface treatment: Ni plating.

.· Does not contain heavy metals such as Ni (nickel) or Cr (chrome).· Low sputtering yield minimizes heavy metal contamination of wafers.

.· Does not contain heavy metals such as Ni (nickel) or Cr (chrome).· Low sputtering yield minimizes heavy metal contamination of wafers.

.· Does not contain heavy metals such as Ni (nickel) or Cr (chrome).· Low sputtering yield minimizes heavy metal contamination of wafers.

.· Does not contain heavy metals such as Ni (nickel) or Cr (chrome).· Low sputtering yield minimizes heavy metal contamination of wafers.

The valve does not contain heavy metals such as Ni (nickel) or Cr (chrome) and a low sputtering yield also helps to minimize heavy metal contamination of semiconductor wafers. Light weight and compact; Uniform baking temperature; High fluorine resistance; Low outgassing; Little heavy metal contamination